The MIL Standard (MIL-STD) supports the preparation of standard for the U.S. Department of Defense. The Standardization has many advantages like:

  • Interoperability
  • Requirements compliance
  • Commonality in MIL related projects
  • Reliability
  • Compatibility with logistics systems

Defense standards are also used by other non-defense government organizations and industry. Related documents, such as defense handbooks and defense specifications, are listed below:

MIL-STD-188A series related to telecommunications
MIL-STD-202Quality standards for electronic parts
MIL-STD-285Attenuation measurements for enclosures
MIL-STD-498On software development and documentation
MIL-STD 461Requirements for the control of electromagnetic interference characteristics
MIL-STD-462DMeasurement of electromagnetic interference characteristics
MIL-STD-464Electromagnetic environmental effects requirements for systems
MIL-STD 790Product assurance program
MIL-STD-810Test methods for determining the environmental effects on equipment
MIL-STD-883Test method standard for microcircuits
MIL-STD-1397Input/output interfaces, standard digital data, for Navy systems
MIL-STD-1553A digital communications bus
MIL-STD-1686B   Electrostatic discharge control and protection program
MIL-STD-1760Smart-weapons interface derived from MIL-STD-1553
MIL-STD-1788A   Avionics interface design
MIL-STD-1815Ada programming language
MIL-STD-1835D   Military standard electronic case outlines
MIL-STD-2196Pertains to optical fiber communications
MIL-STD-2218Thermal design, analysis and test criteria for airborne electronic equipment
MIL-PRF-38534   General specification for hybrid microcircuits
MIL-PRF-38535   General specification for integrated circuits (microcircuits) manufacturing


For testing of microelectronic devices for space and military applications the standard MIL-STD-883 is defined. This standard has following methods for devices qualification:


Environmental tests

Methods 1001-1034


1001 Barometric pressure, reduced (altitude operation)
1002 Immersion
1003 Insulation resistance
1004.7 Moisture resistance
1005.8 Steady-state life
1006 Intermittent life
1007 Agree life
1008.2 Stabilization bake
1009.8 Salt atmosphere
1010.8 Temperature cycling
1011.9 Thermal shock
1012.1 Thermal characteristics
1013 Dew point
1014.13 Seal
1015.10 Burn-in test
1016.2 Life/reliability characterization tests
1017.2 Neutron irradiation
1018.6 Internal gas analysis
1019.8 Ionizing radiation (total dose) test procedure
1020.1 Dose rate induced latchup test procedure
1021.3 Dose rate upset testing of digital microcircuits
1022 Mosfet threshold voltage
1023.3 Dose rate response of linear microcircuits
1030.2 Preseal burn-in
1031 Thin film corrosion test
1032.1 Package induced soft error test procedure
1033 Endurance life test
1034.1 Die penetrant test


Mechanical tests

Methods 2001-2036


2001.2 Constant acceleration
2002.3 Mechanical shock
2003.7 Solderability
2004.5 Lead integrity
2005.2 Vibration fatigue
2006.1 Vibration noise
2007.2 Vibration, variable frequency
2008.1 Visual and mechanical
2009.9 External visual
2010.10 Internal visual (monolithic)
2011.7 Bond strength (bond pull test)
2012.7 Radiography
2013.1 Internal visual inspection for DPA
2014 Internal visual and mechanical
2015.11 Resistance to solvents
2016 Physical dimensions
2017.7 Internal visual (hybrid)
2018.3 Scanning electron microscope (SEM) inspection of metallization
2019.5 Die shear strength
2020.7 Particle impact noise detection test (PIND)
2021.3 Glassivation layer integrity
2022.2 Wetting balance solderability
2023.5 Nondestructive bond pull
2024.2 Lid torque for glass-frit-sealed packages
2025.4 Adhesion of lead finish
2026 Random vibration
2027.2 Substrate attach strength
2028.4 Pin grid package destructive lead pull test
2029 Ceramic chip carrier bond strength
2030 Ultrasonic inspection of die attach
2031.1 Flip chip pull-off test
2032.1 Visual inspection of passive elements
2035 Ultrasonic inspection of TAB bonds
2036 Resistance to soldering heat


Digital Electrical tests

Methods 3001-3024


3001.1 Drive source, dynamic
3002.1 Load conditions
3003.1 Delay measurements
3004.1 Transition time measurements
3005.1 Power supply current
3006.1 High level output voltage
3007.1 Low level output voltage
3008.1 Breakdown voltage, input or output
3009.1 Input current, low level
3010.1 Input current, high level
3011.1 Output short circuit current
3012.1 Terminal capacitance
3013.1 Noise margin measurements for digital microelectronic devices
3014 Functional testing
3015.8 Electrostatic discharge sensitivity classification
3016 Activation time verification
3017 Microelectronics package digital signal transmission
3018 Crosstalk measurements for digital microelectronic device packages
3019.1 Ground and power supply impedance measurements for digital microelectronics device packages
3020 High impedance (off-state) low-level output leakage current
3021 High impedance (off-state) high-level output leakage current
3022 Input clamp voltage
3023.1 Static latch-up measurements for digital CMOS microelectronic devices
3024 Simultaneous switching noise measurements for digital microelectronic devices


Linear Electrical tests

Methods 4001-4007


4001.1 Input offset voltage and current and bias current
4002.1 Phase margin and slew rate measurements
4003.1 Common mode input voltage range, Common mode rejection ratio, Supply voltage rejection ratio
4004.2 Open loop performance
4005.1 Output performance
4006.1 Power gain and noise figure
4007 Automatic gain control range


Test procedures

Methods 5001-5013


5001 Parameter mean value control
5002.1 Parameter distribution control
5003 Failure analysis procedures for microcircuits
5004.11 Screening procedures
5005.15 Qualification and quality conformance procedures
5006 Limit testing
5007.7 Wafer lot acceptance
5008.9 Test procedures for hybrid and multichip microcircuits
5009.1 Destructive physical analysis
5010.4 Test procedures for custom monolithic microcircuits
5011.5 Evaluation and acceptance procedures for polymeric adhesives
5012.1 Fault coverage measurement for digital microcircuits
5013 Wafer fabrication control and wafer acceptance procedures for processed GaAs wafers