The standard ECSS-Q-ST-60-13C (Commercial electrical, electronic and electromechanical (EEE) components) defines the requirements for selection and evaluation of active (semiconductor) components for space applications. Following groups are defined:
- Diodes
- Microwave diodes
- Integrated circuits
- Microwave integrated circuits (MMIC)
- Transistors
- Microwave transistors
Three classes are described in this standard.
CLASS 1
| TEST | SAMPLING /CRITERIA | METHOD | |
| 1 | Construction analysis | 5 parts | As per clause 4.2.3.3 see Annex H. |
| 2 | Mechanical shocks | 10 parts min | MIL STD 883 TM 2002 condition B – 50 pulses (per orientation) instead of 5 pulses (per orientation).
MIL-STD-750 TM 2016, 1500g, 0,5ms duration – 50 shocks instead of 5 shocks, planes X1, Y1 and Z1. |
| Vibrations | MIL-STD-883, TM 2007 condition A – 120 times (total) instead of 12 times (total).
MIL-STD-750, TM 2056, 20g, 10-2000Hz, cross over at 50Hz – 120 times (total) instead of 12 times (total). |
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| Constant acceleration | MIL-STD-883, TM 2001 condition E (resultant centrifugal acceleration to be in the Y1 axis only).
For components which have a package weight of 5 grammes or more, or whose inner seal or cavity perimeter is more than 5 cm, Condition D shall be used. MIL-STD-750, TM 2006, 20000g, planes X1, Y1 and Y2. |
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| 3 | Preconditioning
+ 96h HAST (or 1000h THB 85/85) |
10 parts
0 defect accepted |
HAST 96h-130°C-85%RH (JESD22-A110 with continuous bias) or THB (JESD22-A101).
Electrical test (para-metrical and functional) at 25°C as per the internal supplier’s specification. Preconditioning: i.a.w. JESD-22-A113 for SMD JESD-22-B106 for through hole. |
| 4 | C-SAM | 10 parts | JEDEC J-STD-020 |
| 5 | Preconditioning
+ Thermal Cycling |
10 parts
0 defect accepted |
100 T/C -55°/+125°C (or to the manufacturer storage temp., whichever is less) MIL-STD-750 method 1051 cond.B MIL-STD-883 method 1010 cond.B
Electrical test (para-metrical and functional) at 25°C as per the internal supplier’s specification. Preconditioning: i.a.w. JESD-22-A113 for SMD JESD-22-B106 for through hole. |
| 6 | Seal test | 10 parts min | MIL-STD-883 TM 1014 condition A or B (fine leak) and condition C (gross leak).
MIL-STD-750 TM 1071 condition H1 or H2 (fine leak) and condition C or K (gross leak with cavity) or condition E (gross leak without cavity). |
| 7 | C-SAM | 10 parts | JEDEC J-STD-020 |
| 8 | Lifetest | 15 parts
0 defect accepted |
2000h – 125°C minimum
MIL-STD-750 method 1026 or 1042 MIL-STD-883 method 1005 cond.D Initial, intermediate (1000h) and final electrical test (para-metrical and functional) at 3 temp as per the internal supplier’s specification |
| 9 | External visual inspection | 10 parts min | ESCC 2055000
ESCC 2059000 |
| 10 | Radiation Verification Test | i.a.w.
ECSS-Q-ST-60-15 |
See ECSS-Q-ST-60-15 |
CLASS 2
| TEST | SAMPLING /CRITERIA | METHOD | |
| 1 | Construction analysis | 5 parts | As per clause 5.2.3.3 see Annex H. |
| 2 | Mechanical shocks | 10 parts min | MIL STD 883 TM 2002 condition B – 50 pulses (per orientation) instead of 5 pulses (per orientation).
MIL-STD-750 TM 2016, 1500g, 0,5ms duration – 50 shocks instead of 5 shocks, planes X1, Y1 and Z1. |
| Vibrations | MIL-STD-883, TM 2007 condition A – 120 times (total) instead of 12 times (total).
MIL-STD-750, TM 2056, 20g, 10-2000Hz, cross over at 50Hz – 120 times (total) instead of 12 times (total). |
||
| Constant acceleration | MIL-STD-883, TM 2001 condition E (resultant centrifugal acceleration to be in the Y1 axis only).
For components which have a package weight of 5 grams or more, or whose inner seal or cavity perimeter is more than 5 cm, Condition D shall be used MIL-STD-750, TM 2006, 20000g, planes X1, Y1 and Y2. |
||
| 3 | Preconditioning
+ 96h HAST (or 1000h THB 85/85) |
10 parts
0 defect accepted |
HAST 96h-130°C-85%RH (JESD22-A110 with continuous bias) or THB (JESD22-A101).
Electrical test (para-metrical and functional) at 25°C as per the internal supplier’s specification Preconditioning: i.a.w. JESD-22-A113 for SMD JESD-22-B106 for through hole. |
| 4 | C-SAM | 10 parts | JEDEC J-STD-020 |
| 5 | Preconditioning
+ Thermal Cycling |
10 parts
0 defect accepted |
100 T/C -55°/+125°C (or to the manufacturer storage temp., whichever is less) MIL-STD-750 method 1051 cond.B MIL-STD-883 method 1010 cond.B.
Electrical test (para-metrical and functional) at 25°C as per the internal supplier’s specification. Preconditioning: i.a.w. JESD-22-A113 for SMD JESD-22-B106 for through hole. |
| 6 | Seal test | 10 parts min | MIL-STD-883 TM 1014 condition A or B (fine leak) and condition C (gross leak).
MIL-STD-750 TM 1071 condition H1 or H2 (fine leak) and condition C or K (gross leak with cavity) or condition E (gross leak without cavity). |
| 7 | C-SAM | 10 parts | JEDEC J-STD-020 |
CLASS 3
| TEST | SAMPLING /CRITERIA | METHOD | |
| 1 | Construction analysis | 5 parts | As per clause 6.2.3.3see Annex H |
| 2 | Preconditioning+ 96h HAST(or 1000h THB85/85) | 10 parts0 defect accepted | HAST 96h-130°C-85%RH(JESD22-A110 with continuous bias) or THB(JESD22-A101).Electrical test (para-metrical and functional) at 25°C as per the datasheet (selected functional tests and |
| Parameters) Preconditioning: i.a.w. JESD-22-A113 for SMD JESD-22-B106 for through hole. | |||
| 3 | Life test | 15 parts0 defect accepted | 1000h–125°Cminimum.MIL-STD-750 method 1026or1042 MIL-STD-883 method1005 cond .D.
Initial and final electrical test(parametrical and functional)at25°C as per the datasheet |
| (Selected functional tests and parameters). | |||
| 4 | C-SAM | 10 parts | JEDEC J-STD-020 |
| 5 | Preconditioning
+ Thermal Cycling |
10 parts
0 defect accepted |
100 T/C -55°/+125°C (or to the manufacturer storage temp., whichever is less) MIL-STD-750 method 1051 cond.B.
MIL-STD-883 method 1010 cond.B. Electrical test (para-metrical and functional) at 25°C as per the datasheet (selected functional tests and parameters). Preconditioning: i.a.w. JESD-22-A113 for SMD JESD-22-B106 for through hole. |
| 6 | Seal test | 10 parts min | MIL-STD-883 TM 1014 condition A or B (fine leak) and condition C (gross leak).
MIL-STD-750 TM 1071 condition H1 or H2 (fine leak) and condition C or K (gross leak with cavity) or condition E (gross leak without cavity). |
| 7 | C-SAM | 10 parts | JEDEC J-STD-020 |
| 8 | Radiation Verification Test | i.a.w. ECSS-Q-ST-60-15 | See ECSS-Q-ST-60-15 |
DIFFERENCE BETWEEN THE 3 CLASSES
