The Automotive Electronics Council (AEC) is an organization established in 1992 by Chrysler, Ford, and GM for the purpose of establishing common part-qualification and quality-system standards.
The AEC Component Technical Committee is the standardization establishes and approve standards for reliable, high performance electronic components. Components fulfilling these specifications are suitable for use in the harsh automotive environment without additional component-level qualification testing.
Nowadays in the NewSpace filed is the tendency to use automotive parts as space parts. The justification is that the AEC qualification is similar than the space standards but in the reality both are defined for different applications with different environmental conditions and different requirements. Indeed studies are ongoing and try to find out which complementary qualification is necessary for AEC qualified parts to comply with space systems requirements. SPECTRUM is achieving one of this studies.
Most commonly referenced AEC documents are:
• AEC-Q100 „Failure Mechanism Based Stress Test Qualification For Integrated Circuits“
• AEC-Q101 „Failure Mechanism Based Stress Test Qualification For Discrete Semiconductors“
• AEC-Q200 „Stress Test Qualification For Passive Components“
The detailed list of AEC standards is as follows:
AEC Component Technical Committee Charter
• AEC Component Technical Committee Charter – Rev-G
• AEC Membership Application (as published in the AEC Charter Rev-G)
AEC – Q100: Failure Mechanism Based Stress Test Qualification For Integrated Circuits
• AEC – Q100 Rev – H: Failure Mechanism Based Stress Test Qualification For Integrated Circuits (base document)
• AEC – Q100-001 – Rev-C: Wire Bond Shear Test
• AEC – Q100-002 – Rev-E: Human Body Model (HBM) Electrostatic Discharge Test
• AEC – Q100-004 – Rev-D: IC Latch-Up Test
• AEC – Q100-005 – Rev-D1: Non-Volatile Memory Program/Erase Endurance, Data Retention, and Operational Life Test
• AEC – Q100-007 – Rev-B: Fault Simulation and Test Grading
• AEC – Q100-008 – Rev-A: Early Life Failure Rate (ELFR)
• AEC – Q100-009 – Rev-B: Electrical Distribution Assessment
• AEC – Q100-010 – Rev-A: Solder Ball Shear Test
• AEC – Q100-011 – Rev-D: Charged Device Model (CDM) Electrostatic Discharge Test
• AEC – Q100-012 – Rev-: Short Circuit Reliability Characterization of Smart Power Devices for 12V Systems
AEC – Q101: Failure Mechanism Based Stress Test Qualification For Discrete Semiconductors
• AEC – Q101 Rev – D1: Failure Mechanism Based Stress Test Qualification For Discrete Semiconductors (base document)
• AEC – Q101-001 – Rev-A: Human Body Model (HBM) Electrostatic Discharge Test
• AEC – Q101-003 – Rev-A: Wire Bond Shear Test
• AEC – Q101-004 – Rev-: Miscellaneous Test Methods
• AEC – Q101-005 – Rev-A: Charged Device Model (CDM) Electrostatic Discharge Test
• AEC – Q101-006 – Rev-: Short Circuit Reliability Characterization of Smart Power Devices for 12V Systems
AEC – Q102: Failure Mechanism Based Stress Test Qualification for Discrete Optoelectronic Semiconductors in Automotive Applications
• AEC – Q102 Rev-A: Failure Mechanism Based Stress Test Qualification for Optoelectronic Semiconductors in Automotive Applications
• AEC – Q102-001 Rev- (Initial Release): Dew Test
• AEC – Q102-002 Rev- (Initial Release): Board Flex Test
AEC – Q103: Failure Mechanism Based Stress Test Qualification for Sensors in Automotive Applications
• AEC – Q103-002 Rev – (Initial Release): Failure Mechanism Based Stress Test Qualification for Micro Electro-Mechanical System (MEMS) Pressure Sensor Devices
• AEC – Q103-003 Rev – (Initial Release): Failure Mechanism Based Stress Test Qualification for MEMS Microphone Devices
AEC – Q104: Failure Mechanism Based Stress Test Qualification For Multichip Modules (MCM) In Automotive Applications
• AEC – Q104 Rev – (Initial Release): Failure Mechanism Based Stress Test Qualification For Multichip Modules (MCM) In Automotive Applications
AEC – Q200: Stress Test Qualification For Passive Components
• AEC – Q200 Rev – D base: Stress Test Qualification For Passive Components (base document)
• AEC – Q200-001 – Rev-B: Flame Retardance Test
• AEC – Q200-002 – Rev-B: Human Body Model (HBM) Electrostatic Discharge Test
• AEC – Q200-003 – Rev-B: Beam Load (Break Strength) Test
• AEC – Q200-004 – Rev-A: Measurement Procedures for Resettable Fuses
• AEC – Q200-005 – Rev-A: Board Flex / Terminal Bond Strength Test
• AEC – Q200-006 – Rev-A: Terminal Strength (SMD) / Shear Stress Test
• AEC – Q200-007 – Rev-A: Voltage Surge Test
AEC – Q001 Rev – D: Guidelines for Part Average Testing (provides guidelines for using statistical techniques and extended operating conditions to establish part test limits; this approach could be used to provide „Known Good Die.“)
AEC – Q002 Rev – B: Guidelines for Statistical Yield Analysis (provides guidelines for using statistical techniques to detect and remove abnormal lots of integrated circuits)
AEC – Q003 Rev-A : Guidelines for Characterizing the Electrical Performance of Integrated Circuit Products
AEC – Q004 Rev- (Initial Release): Automotive Zero Defects Framework (Describes a set of processes, methods, and tools based on industry best practices that suppliers and users of semiconductor products can use to drive to zero defects.)
AEC – Q005 Rev – A: Pb-Free Test Requirements (Contains a set of tests and defines the minimum requirements for qualification of lead free (Pb-free) metallurgy for components to be used in any automotive electronics application)
AEC – Q006 Rev – A: Qualification Requirements for Components using Copper (Cu) Wire Interconnects